Article in: Acta Physica Sinica
Plasma generated by gas discharge is an indispensable key technology for the preparation of integrated circuits. By using the unique physical and chemical properties endowed by active particles in plasma, advanced green processing technology with orientation, selectivity and nanoscale fineness can be provided for the preparation of VLSI, which can be applied in the deposition, etching, packaging, cleaning and other processes on a large scale. It also has extremely important application prospects in the fields of surface modification of materials, preparation of new materials, biological sterilization and disinfection, plasma stealth, cleaning of medical devices and artificial organs, ozone generation, new light source, waste disposal, etc. Its low-temperature processing characteristics make it one of the most suitable processing technologies for flexible wearable smart materials and devices.
Plasma material processing technology is closely related to the interaction between plasma and materials. Different plasma sources and their discharge designs have different plasma temperature, density, activity type and structure characteristics, which are suitable for different kinds of material treatment. Different kinds of material treatment have different requirements on plasma characteristics, and in turn affect the process and characteristics of plasma discharge. Therefore, it is necessary to conduct in-depth research on plasma discharge technology, plasma characteristic diagnosis, plasma material processing mechanism, etc., especially to establish the correlation and mechanism between plasma and plasma characteristics for various application requirements, so as to promote the application of plasma material processing technology in various fields such as fine processing and new material preparation. The research methods include theoretical numerical simulation, diagnostic and experimental research.
Schematic diagram of plasma discharge and interaction with materials
In view of the challenge and urgency of the research on the key physical problems in the field of plasma discharge and material interaction, the special topic of "Plasma Physics and its Material Treatment" is organized in Chinese Journal of Physics. Some domestic experts active in the forefront of this field are invited to contribute articles in the form of reviews and research papers. From the perspective of plasma physics and its material treatment, The latest research results in this field are discussed comprehensively and deeply. It mainly includes the following three aspects: 1) The basic process and mechanism of plasma discharge, including the research progress of the simulation of low pressure inductive coupled plasma source, the jet characteristics and mechanism of atmospheric pressure pulsed discharge plasma, and the density evolution of atmospheric pressure needle-plate discharge plasma; 2) Plasma characteristics and diagnosis, including the control of electron heating process and discharge parameters in capacitive coupled plasma, the influence of electroasymmetric dual-frequency capacitive coupled CF4/Ar discharge electrode spacing on discharge mode and etched profile, and the study of iso-dissociated spectral diagnosis method based on feedforward neural network; 3) Study on interaction of plasma materials, It includes the research progress of surface treatment and functionalization of non-thermal plasma materials, the research progress of surface treatment uniformity of flexible porous materials by atmospheric plasma, low temperature etching technology of porous materials, preparation of self-healing superhydrophobic coating fibers by plasma, preparation of titanium oxide film by atmospheric corona plasma jet, functionalization modification of graphene by plasma, and helical wave equiionization Research progress of in situ diagnosis of carbon-based films prepared by daughter and plasma gasification for solid waste treatment.
It is hoped that this topic will promote the progress of plasma physics and its material processing technology and the exchange with various cross-research fields, expand the influence of domestic plasma physics and its material processing research, and promote the vigorous development of this field of research.
