| Number | Content | Specification Parameters |
|---|---|---|
| 1 | Machine specifications | 1820mm(W)×1100mm(D)×1860mm(H) |
| 2 | Vacuum Chamber Specifications | Imported alloy aluminum 1140(W)×1550(D)×1130(H) mm |
| 3 | Electrode Specifications | 16-layer vertical electrode plate (850mm×550mm) |
| 4 | Control System | PC industrial control system + PLC automatic control |
| 5 | Vacuum measurement system | Pirani resistance vacuum gauge |
| 6 | Gas Metering System | Accurate mass flow controller MFC |
| 7 | Number of gas channels | 2-5 working gases are optional: Ar2, N2, H2, CF4, O2 |
| 8 | Plasma generator | 10KW plasma source (40KHz, optional 13.56MHz) |
| 9 | Working gas | 2 working gases are optional: Ar2, N2, H2, O2 |
| Features: High precision, fast response, good handling and compatibility, perfect functions and professional technical support. Uses: Suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. 1. Printed circuit board industry: surface activation of high-frequency boards, surface cleaning and desmearing of multi-layer boards, surface cleaning and desmearing of soft boards and soft-rigid boards, activation of soft boards before reinforcement. 2. Semiconductor IC field: COB, COG, COF, ACF process, used for wire bonding and cleaning before welding. 3. Silica gel, plastic, and polymer fields: surface roughening, etching, and activation of silica gel, plastic, and polymers. |
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